Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.

2. Specifications:

Grain Size	2-4	3-6	4-8	5-10	6-12	8-16	10-20	15-25	20-30	22-36	30-40	36-54
(μm)	√	√	√	√	√	√	√	√	√	√	√	√

Remark: For the conventional granularity in the table, other granularity products can be provided according to customer's requirements.

3. Application:

Precision lapping and polishing of SiC and Al2O3 wafers;
Grinding and polishing of ceramic materials;
Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.

4. Advantage:

Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.

2um 4um Synthetic Diamond Powder Quasi Polycrystalline Diamond Powder

Diamond Drawing Dies

PCD Drawing Dies

Wire Drawing Dies

PDC Drill Bit

PDC Cutters

PCD Cutting Tool Blanks

Synthetic Diamond Powder

Vitrified Diamond Grinding Wheel

Resin Diamond Grinding Wheel

Metal Bond Diamond Grinding Wheel

PCD Saw Blades

Coal Mining Drill Bits

Matrix PDC Bit

PDC Core Bit

2um 4um Synthetic Diamond Powder Quasi Polycrystalline Diamond Powder

polycrystalline diamond powder

monocrystalline diamond powder

synthetic diamond powder